Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel J., Wurz, M. (2020): Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding,  Electronic Components and Technology Conference (ECTC), Jun. 3-30, Orlando, USA, pp.276-283
DOI: 10.1109/ECTC32862.2020.00053

Schneider, F., Long, Y., Ohrdes, H., Twiefel, J., Brökelmann, M., Hunstig, M., Venkatesh, A., Hermsdorf, J., Kaierle, S., Overmeyer, L. (2019): Effect of laser assistance in ultrasonic copper wire bonding,  Lasers in Manufacturing

Long, Y., He, B., Cui, W., Zhuang, X., Twiefel, J. (2018): Molecular dynamics simulation of microwelds formation and breakage during ultrasonic copper wire bonding,  IEEE 68th Electronic Components and Technology Conference
DOI: 10.1109/ECTC.2018.00219

Long, Y.; Dencker, F.; Isaak, A.; Li, C.; Schneider, F.; Hermsdor, J.; Wurz, M.; Twiefel, J.; Wallaschek, J. (2017): Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process,  IEEE CPMT Symposium Japan (ICSJ), Nov 20-22, 2017 Kyoto, Japan, S. 203-206

Long, Y.; Dencker, F.; Isaak, A.; Schneider, F.; Hermsdor, J.; Wurz, M.; Twiefel, J. (2017): Visualization of Oxide Removal during Ultrasonic Wire Bonding Process,  19th IEEE Electronics Packaging Technology Conference (EPTC), Dec 6-9, 2017 Singapore, S. 1-4

Long, Y.; Dencker, F.; Schneider, F.; Emde, B.; Li, C.; Hermsdorf, J.; Wurz, M.; Twiefel, J. (2016): Investigations on the Oxide Removal Mechanism during Ultrasonic Wedge-Wedge Bonding Process,  IEEE 18th Electronics Packaging Technology Conference, November 30 - December 3, Singapore, Southeast Asia, pp. 405-410

Long, Y.; Dencker, F.; Wurz, M.; Feldhoff, A.; Twiefel, J. (2016): A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process,  International Symposium on Microelectronics, October 10-13, Pasadena, USA, pp. 427-432

Long, Y.; Twiefel, J.; Roth, J.; Wallaschek, J. (2015): Real-time observation of interface relative motion during ultrasonic wedge-wedge bonding process,  In International Symposium on Microelectronics, IMAPS (International Microelectronics, Assembly and Packaging Society), pp. 419-424

Lian, Y., Long, Y., Zhao, G., Mu, C., Li, X., Deng, J., Xie, C. (2020): Performance of CrCN-WS2 hard/soft composite coated tools in dry cutting of titanium alloys,  Journal of Manufacturing Processes, 54, pp.201-209
DOI: https://doi.org/10.1016/j.jmapro.2020.03.014

Long, Y., He, B., Cui, W., Ji, Y., Zhuang, X., Twiefel, J. (2020): Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation,  Materials & Design, 192, 108718
DOI: https://doi.org/10.1016/j.matdes.2020.108718

You, C., Zhao, G., Chu, X., Zhou, W., Long, Y., Lian Y. (2020): Design, preparation and cutting performance of bionic cutting tools based on head microstructures of dung beetle,  Journal of Manufacturing Processes, 58, pp.129-135
DOI: https://doi.org/10.1016/j.jmapro.2020.07.057

Zhang, T., Long, Y., Mu, C., Zhou, W., Zhao, G., Lian Y. (2020): Performance of soft/hard composite dual-effect coated tool in dry cutting of carbon fiber–reinforced polymer,  The International Journal of Advanced Manufacturing Technology, 109, pp.2221-2232
DOI: https://doi.org/10.1007/s00170-020-05778-w

Bai, F., Long, Y., Saalbach, K.A., Twiefel, J. (2019): Theoretical and experimental investigations of ultrasonic sound fields in thin bubbly liquid layers for ultrasonic cavitation peening,  Ultrasonics, 93, pp.130-138
DOI: https://doi.org/10.1016/j.ultras.2018.11.010

Li, Y., Cheng, Z., Chen, X., Long, Y., Li, X., Li, F., Li, J., Twiefel, J. (2019): Constitutive modeling and deformation analysis for the ultrasonic-assisted incremental forming process,  The International Journal of Advanced Manufacturing Technology 104, pp.2287–2299
DOI: https://doi.org/10.1007/s00170-019-04031-3

Long, Y., Bai, F., Zhang, Y., Saalbach, K.A., Twiefel, J. (2019): Impacts of ultrasound on oxide removal–An attempt towards acid-free cleaning,  Ultrasonics sonochemistry, 57, pp.1-11
DOI: https://doi.org/10.1016/j.ultsonch.2019.05.003

Long, Y., Schneider, F., Li, C., Hermsdorf, J., Twiefel, J., Wallaschek, J. (2019): Quantification of the energy flows during ultrasonic wire bonding under different process parameters,  International Journal of Precision Engineering and Manufacturing-Green Technology, 6(3), pp.449-463
DOI: https://doi.org/10.1007/s40684-019-00061-0

Long, Y., Twiefel, J., Wallaschek, J. (2019): Contact mechanics and friction processes in ultrasonic wire bonding-Basic theories and experimental investigations,  Journal of Sound and Vibration, p.115021
DOI: https://doi.org/10.1016/j.jsv.2019.115021

Bai, F., Saalbach, K.-A., Long Y., Twiefel, J., Wallaschek, J. (2018): Capability evaluation of ultrasonic cavitation peening at different standoff distances.,  Ultrasonics
DOI: /10.1016/j.ultras.2017.10.013

Long Y., Li Y., Sun J., Ille I., Li J., Twiefel J. (2018): Effects of process parameters on force reduction and temperature variation during ultrasonic assisted incremental sheet forming process, The International Journal of Advanced Manufacturing Technology, pp. 1-12
DOI: https://doi.org/10.1007/s00170-018-1886-0

Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M., Twiefel, J. (2018): Self-Cleaning Mechanisms in Ultrasonic Bonding of Al Wire, Journal of Materials Processing Technology 258, pp. 58-66
DOI: https://doi.org/10.1016/j.jmatprotec.2018.03.016

Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J., Wallaschek, J. (2018): Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding,  Materials Science and Engineering: B
DOI: https://doi.org/10.1016/j.mseb.2018.11.010

Wang, L., Sun, W., Long, Y., Yang, X. (2018): Reliability-Based Performance Optimization of Tunnel Boring Machine Considering Geological Uncertainties, IEEE Access 6, pp. 19086 - 19098
DOI: 10.1109/ACCESS.2018.2821190

Long, Y.; Twiefel, J. and Wallaschek, J. (2017): A review on the mechanisms of ultrasonic wedge-wedge bonding,  Journal of Materials Processing Technology, 245, 2017, pp. 241-258